Finite element analysis of ink-tack delamination of paperboard
Finite element analysis of ink-tack delamination of paperboard were presented. The paperboard was modeled as a multilayered structure with a softening interface model connecting the paperboard plies. The paperboard plies were modeled as orthotropic linear elastic. The ink-tack loading was applied to the board in the form of a moving displacement boundary condition. The purpose of the analysis was
